MARC

 008250114s2024        ulk              d            a    kor
■00120250114151952
■00520250122153748
■082    ▼a621.38152▼223
■1001  ▼a서민석
■24520▼a(AI  시대에  대응하는)  반도체  패키지와  테스트▼h[전자책]▼xSemiconductor  package  &  test▼d서민석  지음
■256    ▼a전자  데이터
■260    ▼a서울▼b한올출판사▼c2024▼f(북큐브네트웍스▼g2024)
■300    ▼a전자책  1책▼b천연색
■516    ▼acPDF
■520    ▼a데이터의  사용량이  크게  증가하는  AI  시대에는  적층,  이종  적합,  시스템인패키지  등  다양한  첨단  반도체  패키지  기술의  중요성이  커지고  있다.  특히  HBM과  이를  위한  TSV  적층  기술,  칩렛Chiplet과  하이브리드  본딩,  인터포저  기술은  첨단  반도체  패키지의  팩심  기술이  되고  있다.
■530    ▼a책자형태로  간행:  ISBN  9791166475016
■653    ▼a반도체▼aAI
■7760  ▼t(AI  시대에  대응하는)  반도체  패키지와  테스트▼z9791166475016
■85642▼uhttp://ebook.gtec.ac.kr/FxLibrary/product/view/?num=241103588
■9500  ▼b\40000

Preview

Export

ChatGPT Discussion

AI Recommended Related Books