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Yield and Compression Behavior of Semi-Solid Material by Upper-Bound Method
Yield and Compression Behavior of Semi-Solid Material by Upper-Bound Method
Detailed Information
- Material Type
- 기사
- ISSN
- 12298557
- Title/Author
- Yield and Compression Behavior of Semi-Solid Material by Upper-Bound Method / Joan Hong Park, Chul Kim, Byung Min Kim andJae Chan Choi
- Material Info
- pp. 23
- Added Entry-Personal Name
- Joan Hong Park, Chul Kim, Byung Min Kim andJae Chan Choi
- 모체레코드
- 모체정보확인
- Control Number
- gtec:382510
MARC
008171213s2001 aa kor■022 ▼a12298557
■245 ▼aYield and Compression Behavior of Semi-Solid Material by Upper-Bound Method▼dJoan Hong Park, Chul Kim, Byung Min Kim andJae Chan Choi
■300 ▼app. 23
■7001 ▼aJoan Hong Park, Chul Kim, Byung Min Kim andJae Chan Choi
■773 ▼tInternational Journal of Precision Engineering and Manufacturing▼gv.2 n.4▼d2001, 11
■SIS ▼aKS010009▼b63235▼h3▼sG
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