서브메뉴
검색
Yield and Compression Behavior of Semi-Solid Material by Upper-Bound Method
Yield and Compression Behavior of Semi-Solid Material by Upper-Bound Method
Detailed Information
- 자료유형
- 기사
- ISSN
- 12298557
- 서명/저자
- Yield and Compression Behavior of Semi-Solid Material by Upper-Bound Method / Joan Hong Park, Chul Kim, Byung Min Kim andJae Chan Choi
- 형태사항
- pp. 23
- 모체레코드
- 모체정보확인
- Control Number
- gtec:382510
MARC
008171213s2001 aa kor■022 ▼a12298557
■245 ▼aYield and Compression Behavior of Semi-Solid Material by Upper-Bound Method▼dJoan Hong Park, Chul Kim, Byung Min Kim andJae Chan Choi
■300 ▼app. 23
■7001 ▼aJoan Hong Park, Chul Kim, Byung Min Kim andJae Chan Choi
■773 ▼tInternational Journal of Precision Engineering and Manufacturing▼gv.2 n.4▼d2001, 11
■SIS ▼aKS010009▼b63235▼h3▼sG
Preview
Export
ChatGPT Discussion
AI Recommended Related Books
Buch Status
- Reservierung
- Book Loan Request Service
- Meine Mappe
