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Mitigation of Noise Coupling in Multilayer High-Speed PCB: State of the Art Modeling Methodology and EBG Technology (INVITED)
Mitigation of Noise Coupling in Multilayer High-Speed PCB: State of the Art Modeling Methodology and EBG Technology (INVITED)
Detailed Information
- 자료유형
- 기사
- ISSN
- 09168516
- 서명/저자
- Mitigation of Noise Coupling in Multilayer High-Speed PCB: State of the Art Modeling Methodology and EBG Technology (INVITED) / Wu, T.-L. ; Fan, J. ; de Paulis, F.
- 형태사항
- pp. 1678
- 기타저자
- Wu, T.-L.
- 기타저자
- Fan, J.
- 기타저자
- de Paulis, F.
- 모체레코드
- 모체정보확인
- Control Number
- gtec:381981
MARC
008171211s2010 aa eng■022 ▼a09168516
■245 ▼aMitigation of Noise Coupling in Multilayer High-Speed PCB: State of the Art Modeling Methodology and EBG Technology (INVITED)▼dWu, T.-L.▼eFan, J.▼ede Paulis, F.
■300 ▼app. 1678
■7001 ▼aWu, T.-L.
■7001 ▼aFan, J.
■7001 ▼ade Paulis, F.
■773 ▼tIEICE Transactions on Communications▼gv.E93-B n.7▼d2010, 07
■SIS ▼aKS022704▼b63226▼h3▼sG
