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Multi-slicing of Semiconductors by Wire Electrical Discharge Machining Technology
Multi-slicing of Semiconductors by Wire Electrical Discharge Machining Technology
Detailed Information
- 자료유형
- 기사
- ISSN
- 09120289
- 서명/저자
- Multi-slicing of Semiconductors by Wire Electrical Discharge Machining Technology / Yasuhiro OKAMOTO and Akira OKADA
- 형태사항
- pp. 825
- 모체레코드
- 모체정보확인
- Control Number
- gtec:378687
MARC
008171204s2017 aa jpn■022 ▼a09120289
■245 ▼aMulti-slicing of Semiconductors by Wire Electrical Discharge Machining Technology▼dYasuhiro OKAMOTO and Akira OKADA
■300 ▼app. 825
■7001 ▼aYasuhiro OKAMOTO and Akira OKADA
■773 ▼t精密工學會誌(日) : 정밀공학회지▼gv.83 n.9▼d2017, 09
■SIS ▼aKS035920▼b63119▼h3▼sG
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