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The Effects of Fatigue Diffusion by Lead Free Solder SnAg3.5Cu0.5Sb2 of BGA Packaging
The Effects of Fatigue Diffusion by Lead Free Solder SnAg3.5Cu0.5Sb2 of BGA Packaging
Detailed Information
- 자료유형
- 기사
- ISSN
- 17388228
- 서명/저자
- The Effects of Fatigue Diffusion by Lead Free Solder SnAg3.5Cu0.5Sb2 of BGA Packaging / Kyoung Soo Kim
- 형태사항
- pp. 635
- 기타저자
- Kyoung Soo Kim
- 모체레코드
- 모체정보확인
- Control Number
- gtec:353328
MARC
008171023s2007 a a jpn■022 ▼a17388228
■245 ▼aThe Effects of Fatigue Diffusion by Lead Free Solder SnAg3.5Cu0.5Sb2 of BGA Packaging▼dKyoung Soo Kim
■300 ▼app. 635
■7001 ▼aKyoung Soo Kim
■773 ▼t대한금속ㆍ재료학회지▼gv.45 n.11▼d2007, 11
■SIS ▼aKS017607▼b63212▼h3▼sG
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