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Galvanic corrosion of Cu coupled to Au on a print circuit board; Effects of pretreatment solution and etchant concentration in organic solderability preservatives soft etching solution
Galvanic corrosion of Cu coupled to Au on a print circuit board; Effects of pretreatment s...
Galvanic corrosion of Cu coupled to Au on a print circuit board; Effects of pretreatment solution and etchant concentration in organic solderability preservatives soft etching solution

Detailed Information

자료유형  
 기사
ISSN  
15989623
서명/저자  
Galvanic corrosion of Cu coupled to Au on a print circuit board; Effects of pretreatment solution and etchant concentration in organic solderability preservatives soft etching solution / Oh, S. ; Kim, Y. ; Shon, M.
형태사항  
pp. 781
기타저자  
Oh, S.
기타저자  
Kim, Y.
기타저자  
Shon, M.
기본자료저록  
Metals and Materials International : v.22 n.5 2016, 09
모체레코드  
모체정보확인
Control Number  
gtec:350541

MARC

 008171019s2016              a    a                          kor
■022    ▼a15989623
■245    ▼aGalvanic  corrosion  of  Cu  coupled  to  Au  on  a  print  circuit  board;  Effects  of  pretreatment  solution  and  etchant  concentration  in  organic  solderability  preservatives  soft  etching  solution▼dOh,  S.▼eKim,  Y.▼eShon,  M.
■300    ▼app.  781
■7001  ▼aOh,  S.
■7001  ▼aKim,  Y.
■7001  ▼aShon,  M.
■773    ▼tMetals  and  Materials  International▼gv.22  n.5▼d2016,  09
■SIS    ▼aKS032906▼b63240▼h3▼sG

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