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Transmission electron microscopy study of the failure mechanism of the diffusion barriers (TiN and TaN) between Al and Cu
Transmission electron microscopy study of the failure mechanism of the diffusion barriers (TiN and TaN) between Al and Cu
Detailed Information
- 자료유형
- 기사
- ISSN
- 15989623
- 서명/저자
- Transmission electron microscopy study of the failure mechanism of the diffusion barriers (TiN and TaN) between Al and Cu / Kim, S. H.
- 형태사항
- pp. 141
- 기타저자
- Kim, S. H.
- 모체레코드
- 모체정보확인
- Control Number
- gtec:346891
MARC
008171016s2017 a a kor■022 ▼a15989623
■245 ▼aTransmission electron microscopy study of the failure mechanism of the diffusion barriers (TiN and TaN) between Al and Cu▼dKim, S. H.
■300 ▼app. 141
■7001 ▼aKim, S. H.
■773 ▼tMetals and Materials International▼gv.23 n.1▼d2017, 01
■SIS ▼aKS033522▼b63240▼h3▼sG
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