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Evaluation of tensile stress-strain curve of electroplated copper film by characterizing indentation size effect with a single nanoindentation
Evaluation of tensile stress-strain curve of electroplated copper film by characterizing indentation size effect with a single nanoindentation
Detailed Information
- Material Type
- 기사
- ISSN
- 15989623
- Title/Author
- Evaluation of tensile stress-strain curve of electroplated copper film by characterizing indentation size effect with a single nanoindentation / Kim, S. H. ; Kim, Y. C. ; Lee, S.
- Material Info
- pp. 76
- Added Entry-Personal Name
- Kim, S. H.
- Added Entry-Personal Name
- Kim, Y. C.
- Added Entry-Personal Name
- Lee, S.
- Host Item Entry
- Metals and Materials International : v.23 n.1 2017, 01
- 모체레코드
- 모체정보확인
- Control Number
- gtec:346883
MARC
008171016s2017 a a kor■022 ▼a15989623
■245 ▼aEvaluation of tensile stress-strain curve of electroplated copper film by characterizing indentation size effect with a single nanoindentation▼dKim, S. H.▼eKim, Y. C.▼eLee, S.
■300 ▼app. 76
■7001 ▼aKim, S. H.
■7001 ▼aKim, Y. C.
■7001 ▼aLee, S.
■773 ▼tMetals and Materials International▼gv.23 n.1▼d2017, 01
■SIS ▼aKS033522▼b63240▼h3▼sG
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