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Monitoring Thermal Stress in Wafer-Scale Integrated Circuits by the Attentive Vision Method Using an Infrared Camera
Monitoring Thermal Stress in Wafer-Scale Integrated Circuits by the Attentive Vision Method Using an Infrared Camera
Detailed Information
- 자료유형
- 기사
- ISSN
- 10518215
- 서명/저자
- Monitoring Thermal Stress in Wafer-Scale Integrated Circuits by the Attentive Vision Method Using an Infrared Camera / Lakhssassi, A. ; Palenychka, R. ; Savaria, Y.
- 형태사항
- pp. 412
- 기타저자
- Lakhssassi, A.
- 기타저자
- Palenychka, R.
- 기타저자
- Savaria, Y.
- 모체레코드
- 모체정보확인
- Control Number
- gtec:329335
MARC
008170918s2016 a a kor■022 ▼a10518215
■245 ▼aMonitoring Thermal Stress in Wafer-Scale Integrated Circuits by the Attentive Vision Method Using an Infrared Camera▼dLakhssassi, A.▼ePalenychka, R.▼eSavaria, Y.
■300 ▼app. 412
■7001 ▼aLakhssassi, A.
■7001 ▼aPalenychka, R.
■7001 ▼aSavaria, Y.
■773 ▼tIEEE transactions on circuits and systems for video technology▼gv.26 n.2▼d2016, 02
■SIS ▼aKS032037▼b63262▼h3▼sG
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