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Effects of microcrack evolution on the electrical resistance of Cu thin films on flexible PI substrates during cyclic-bend testing
Effects of microcrack evolution on the electrical resistance of Cu thin films on flexible ...
Effects of microcrack evolution on the electrical resistance of Cu thin films on flexible PI substrates during cyclic-bend testing

Detailed Information

자료유형  
 기사
ISSN  
15989623
서명/저자  
Effects of microcrack evolution on the electrical resistance of Cu thin films on flexible PI substrates during cyclic-bend testing / Bag, A. ; Park, K. S. ; Choi, S. H.
형태사항  
pp. 673
기타저자  
Bag, A.
기타저자  
Park, K. S.
기타저자  
Choi, S. H.
기본자료저록  
Metals and Materials International : v.23 n.4 2017, 07
모체레코드  
모체정보확인
Control Number  
gtec:323810

MARC

 008170908s2017              a    a                          kor
■022    ▼a15989623
■245    ▼aEffects  of  microcrack  evolution  on  the  electrical  resistance  of  Cu  thin  films  on  flexible  PI  substrates  during  cyclic-bend  testing▼dBag,  A.▼ePark,  K.  S.▼eChoi,  S.  H.
■300    ▼app.  673
■7001  ▼aBag,  A.
■7001  ▼aPark,  K.  S.
■7001  ▼aChoi,  S.  H.
■773    ▼tMetals  and  Materials  International▼gv.23  n.4▼d2017,  07
■SIS    ▼aKS034505▼b63240▼h3▼sG

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