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Effects of microcrack evolution on the electrical resistance of Cu thin films on flexible PI substrates during cyclic-bend testing
Effects of microcrack evolution on the electrical resistance of Cu thin films on flexible PI substrates during cyclic-bend testing
상세정보
- 자료유형
- 기사
- ISSN
- 15989623
- 서명/저자
- Effects of microcrack evolution on the electrical resistance of Cu thin films on flexible PI substrates during cyclic-bend testing / Bag, A. ; Park, K. S. ; Choi, S. H.
- 형태사항
- pp. 673
- 기타저자
- Bag, A.
- 기타저자
- Park, K. S.
- 기타저자
- Choi, S. H.
- 모체레코드
- 모체정보확인
- Control Number
- gtec:323810
MARC
008170908s2017 a a kor■022 ▼a15989623
■245 ▼aEffects of microcrack evolution on the electrical resistance of Cu thin films on flexible PI substrates during cyclic-bend testing▼dBag, A.▼ePark, K. S.▼eChoi, S. H.
■300 ▼app. 673
■7001 ▼aBag, A.
■7001 ▼aPark, K. S.
■7001 ▼aChoi, S. H.
■773 ▼tMetals and Materials International▼gv.23 n.4▼d2017, 07
■SIS ▼aKS034505▼b63240▼h3▼sG
