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Sn-Ag-Cu to Cu Joint Current Aging Test and Evolution of Resistance and Microstructure
Sn-Ag-Cu to Cu Joint Current Aging Test and Evolution of Resistance and Microstructure
Detailed Information
- 자료유형
- 기사
- ISSN
- 17388090
- 서명/저자
- Sn-Ag-Cu to Cu Joint Current Aging Test and Evolution of Resistance and Microstructure / Di Erick Xu ; Jasper Chow, Michael Mayer
- 형태사항
- pp. 1078
- 기타저자
- Di Erick Xu
- 모체레코드
- 모체정보확인
- Control Number
- gtec:294424
MARC
008151124s2015 a a eng■022 ▼a17388090
■245 ▼aSn-Ag-Cu to Cu Joint Current Aging Test and Evolution of Resistance and Microstructure▼dDi Erick Xu▼eJasper Chow, Michael Mayer
■300 ▼app. 1078
■7001 ▼aDi Erick Xu
■7001 ▼aJasper Chow, Michael Mayer
■773 ▼tElectronic Materials Letters▼gv.11 n.6▼d2015, 11
■SIS ▼aKS031443▼b63247▼h3▼sG
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