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Sn-Ag-Cu to Cu Joint Current Aging Test and Evolution of Resistance and Microstructure
Sn-Ag-Cu to Cu Joint Current Aging Test and Evolution of Resistance and Microstructure
Detailed Information
- Material Type
- 기사
- ISSN
- 17388090
- Title/Author
- Sn-Ag-Cu to Cu Joint Current Aging Test and Evolution of Resistance and Microstructure / Di Erick Xu ; Jasper Chow, Michael Mayer
- Material Info
- pp. 1078
- Added Entry-Personal Name
- Di Erick Xu
- Added Entry-Personal Name
- Jasper Chow, Michael Mayer
- Host Item Entry
- Electronic Materials Letters : v.11 n.6 2015, 11
- 모체레코드
- 모체정보확인
- Control Number
- gtec:294424
MARC
008151124s2015 a a eng■022 ▼a17388090
■245 ▼aSn-Ag-Cu to Cu Joint Current Aging Test and Evolution of Resistance and Microstructure▼dDi Erick Xu▼eJasper Chow, Michael Mayer
■300 ▼app. 1078
■7001 ▼aDi Erick Xu
■7001 ▼aJasper Chow, Michael Mayer
■773 ▼tElectronic Materials Letters▼gv.11 n.6▼d2015, 11
■SIS ▼aKS031443▼b63247▼h3▼sG
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