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Electromigration of Composite Sn-Ag-Cu Solder Bumps
Electromigration of Composite Sn-Ag-Cu Solder Bumps / Ashutosh Sharma ; Di Erick Xu, Jaspe...
Electromigration of Composite Sn-Ag-Cu Solder Bumps

Detailed Information

자료유형  
 기사
ISSN  
17388090
서명/저자  
Electromigration of Composite Sn-Ag-Cu Solder Bumps / Ashutosh Sharma ; Di Erick Xu, Jasper Chow
형태사항  
pp. 1072
기타저자  
Ashutosh Sharma
기타저자  
Di Erick Xu, Jasper Chow
기본자료저록  
Electronic Materials Letters : v.11 n.6 2015, 11
모체레코드  
모체정보확인
Control Number  
gtec:294423

MARC

 008151124s2015              a    a                          eng
■022    ▼a17388090
■245    ▼aElectromigration  of  Composite  Sn-Ag-Cu  Solder  Bumps▼dAshutosh  Sharma▼eDi  Erick  Xu,  Jasper  Chow
■300    ▼app.  1072
■7001  ▼aAshutosh  Sharma
■7001  ▼aDi  Erick  Xu,  Jasper  Chow
■773    ▼tElectronic  Materials  Letters▼gv.11  n.6▼d2015,  11
■SIS    ▼aKS031443▼b63247▼h3▼sG

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