서브메뉴
검색
Electromigration of Composite Sn-Ag-Cu Solder Bumps
Electromigration of Composite Sn-Ag-Cu Solder Bumps
상세정보
- 자료유형
- 기사
- ISSN
- 17388090
- 서명/저자
- Electromigration of Composite Sn-Ag-Cu Solder Bumps / Ashutosh Sharma ; Di Erick Xu, Jasper Chow
- 형태사항
- pp. 1072
- 기타저자
- Ashutosh Sharma
- 모체레코드
- 모체정보확인
- Control Number
- gtec:294423
MARC
008151124s2015 a a eng■022 ▼a17388090
■245 ▼aElectromigration of Composite Sn-Ag-Cu Solder Bumps▼dAshutosh Sharma▼eDi Erick Xu, Jasper Chow
■300 ▼app. 1072
■7001 ▼aAshutosh Sharma
■7001 ▼aDi Erick Xu, Jasper Chow
■773 ▼tElectronic Materials Letters▼gv.11 n.6▼d2015, 11
■SIS ▼aKS031443▼b63247▼h3▼sG
