MARC

 008090603s2001        ulka                    000      kor
■020    ▼a8955260199
■0801  ▼a621.382
■082    ▼a621.38152▼bN163ㅂ▼223
■090    ▼a621.38152▼bN163ㅂ
■1001  ▼aT.  Doi,  T.  Kasai,  T.  Nakagawa  저
■24510▼a반도체  평탄화  CMP  기술▼dT.  Doi,  T.  Kasai,  T.  Nakagawa  저▼e이충훈,  송형수,  명중재,  박진구  공역
■260    ▼a서울▼b북스  힐▼c2001
■300    ▼a283p.▼b삽도▼c23cm
■505    ▼a1장  총론  -  차세대  LSI  공정에서의  CMP의  역할▼c1▼a1.1  진공관으로부터  IC  그리고  LSI까지의  과정▼c1▼a1.2  LSI는  지금  평탄화  CMP를  필요로  한다▼c3▼a1.3  평탄화  수법과  CMP▼c7▼a1.4  CMP의  적용  공정과  요구  조건▼c10▼a1.5  결론▼c21▼a참고문헌▼c23▼a2장  초정밀  가공기술과  CMP의  기초-CMP의  위치  부여와  CMP가공  mechanism▼c25▼a2.1  서론▼c25▼a2.2  CMP에  대한  요구  사항▼c2700▼a2.3  각종  초정밀  가공법과  가공의  mechanism▼c2811▼a2.4  CMP의  여러  가지  요인▼c3922▼a참고문헌▼c4633▼a3장  CMP의  요소기술▼c4944▼a3.1  CMP의  장치화  기술▼c4955▼a3.2  품위와  능률을  좌우하는  슬러리▼c7366▼a3.3  평탄화  정밀도를  결정하는  연마  패드▼c9677▼a3.4  CMP  후  세정  공정▼c11488▼a3.5  CMP  도중  계측과  평가  기술▼c13399▼a참고문헌▼c14700▼a4장  디바이스에  적용  사례▼c15311▼a4-1  Logic  디바이스에  적용▼c15322▼a저유전율  절연막의  평탄화  기술▼c15333▼alogic  ULSI  기초기술에의  응용▼c17044▼a4.2  Memory  디바이스에  적용▼c18755▼a4.3  차세대  배선  기술▼c20266▼a4.4  SOI  디바이스에  응용▼c23677▼a참고문헌▼c26088▼a5장  CMP의  장래▼c26999▼a찾아보기▼c27900
■9500  ▼c15,000

Preview

Export

ChatGPT Discussion

AI Recommended Related Books